銷售美國(guó)Ticona VECTRAZ T.rex541 LCP材料介紹:
Extrusion/Thermoforming美國(guó)Ticona LCP材料簡(jiǎn)介：
ZENITE LCP liquid crystal polymerresins are easily melt processible
and have a number of highly desirable properties that make them
especially suitable for precision electrical and electronic parts in
lighting, ecommunications, aerospace, automotive, fibre optics
and other advanced uses. Typical applications include connectors,
bobbins, relays, motor components, sockets, imaging and sensor
devices, ignition systems, etc.
The ZENITE LCP family featuresexcellent dimensional stability and
creep resistance, especially at very high temperatures. When in a
molten state its molecules tend to align with the flow, providing
even greater strength in the flow direction; this also contributes
to its superior wide-temperature range.
The physical advantage of low thermal expansion and low mould
shrinkage-properties is further enhanced in thin-wall sections due
to even more pronounced molecular alignment. In addition these
resins are highly resistant to many chemicals, including concentrated
acids, bases and hydrocarbons. They also display outstanding
fatigue resistance and high dielectric strength performance
over a very widetemperature range.
美國(guó)Ticona LCP材料簡(jiǎn)介：
1. Because of its toughness and mechanical strength over a broadtemperature range, ZENITE 6130 liquid crystalpolymers as found in compact coil forms, offer United Technical Products
Inc. board assembly advantages and result in excellent pin retention.Itssuitability for precision moulding in thin sections allows board space savingat equal winding space. The material is UL94 V0 recognized.
2. Injection moulded microminiature surface-mount Conan™ connectors,used inportable phones and computers,are a classic case for ZENITE. High thermal stability, precisionsurfaces and strength in thin walls are crucial factors in the field ofmicro-electronics.
3. The qualities of ZENITE permit these bobbin assemblies to obtain increased windingspace, excellent pin positioning and to withstand SMT soldering processes.
4. In the miniature world of Litfuse Inc., ZENITE LCP is welcomed for use in holders for ceramic fuses and for theencapsulation of glass fuses. It allows assembly by infrared and other solderingprocesses. The strength of the material is put to the test every time a fusehas to be replaced; a test successfully passed with ZENITE.
5. ZENITE can also be perfectlyand easily metallised. For this reason, this lamp socket, made by VLM, ismoulded in ZENITE, with a very hightemperature resistance as a result. Extra high thermal resistance LCP replaces other high temperature polymers, whichsometimes melt under these extreme conditions.
6. The market trend is to design smaller antifog lamps with more powerful bulbs,hence the temperature reached inside the housing has dramatically increased. ZENITE 6330 BK was selected for its excellent heat resistance,no out-gassing, and goodsurface appearance.
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